Tombstoning is a defect where a two-leaded, wrap-around lead-style termination chip component fails to lay down appropriately and allow solder to simultaneously make a required electrical/mechanical ...

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Soldering irons, solder extractors and other equipment that comes in direct electrical contact with sensitive components can inject significant energy into these devices. Specifically, metal-to-metal ...

In our previous article on Ball Grid Arrays (BGAs), we explored how to design circuit boards and how to route the signals coming out of a BGA package. But designing a board is one thing – soldering ...

To package temperature-sensitive glass/glass and glass/ceramics component groups, especially those with large substrate surfaces to be sealed, the laser-based joining process using glass solder is ...